Precision Adhesive Dispensing Machine
Apply three (3) micro-dots per second with 25-micron accuracy.
This system applies adhesive onto a substrate at a very high rate of speed and with micron-level precision. This sophisticated process tool uses high performance machine vision and precision motion control to apply small glue dots (300-micron diameter) to the surface of a wafer.
Wafers are loaded via cassette or single station, then placed on the X-Y stage using a Brooks/PRI wafer handling robot. An integral vision system dynamically inspects dot size and location during the process.
| Technical Specifications | |
|---|---|
| Handling Robot: |
Equipe/PRI Automation. |
| Control System: |
Windows NT™ with RTX real time extension; custom control program in C™. |
| Operator Interface: |
Custom multi-screen operator interface written in C ™. |
| Wafer Tracking: |
Cognex® OCR system to read wafer serial number. |
| Servo Control: |
Galil® four-axis motion control. |
| Environment: |
Class 10,000 clean room. |
| Discrete I/O: |
Approximately 144 I/O points. |
| Throughput: |
Three (3) dots/second. |
| Vision System: |
Cognex® with Melles Griot optics. |
| Accuracy: |
± 25-micron placement accuracy. |
| Key Attributes: |
High speed, high precision glue dispensing with vision inspection. Inspection data written to a log associated with the wafer. |
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