Precision Adhesive Dispensing Machine
Apply three (3) micro-dots per second with 25-micron accuracy.
This system applies adhesive onto a substrate at a very high rate of speed and with micron-level precision. This sophisticated process tool uses high performance machine vision and precision motion control to apply small glue dots (300-micron diameter) to the surface of a wafer.
Wafers are loaded via cassette or single station, then placed on the X-Y stage using a Brooks/PRI wafer handling robot. An integral vision system dynamically inspects dot size and location during the process.
Windows NT™ with RTX real time extension; custom control program in C™.
Custom multi-screen operator interface written in C ™.
Cognex® OCR system to read wafer serial number.
Galil® four-axis motion control.
Class 10,000 clean room.
Approximately 144 I/O points.
Three (3) dots/second.
Cognex® with Melles Griot optics.
± 25-micron placement accuracy.
High speed, high precision glue dispensing with vision inspection. Inspection data written to a log associated with the wafer.