Our technology experience is applied in a wide range of applications, whether in standardized product or custom machine form.
Micro Fastener Insertion
We develop machines that assemble and press micro-sized tack pins as small as 1mm diameter for use in mobile devices, keyboard assembly and other consumer electronics. Our machines perform 1.1 insertions per second to 10-micron repeatability.
We develop sophisticated machines that dispense viscous and non-viscous liquids with high precision, volume control and placement. As an example, we can repeatedly apply 300-micron glue dots at a rate of 3 per second with 25-micron accuracy.
Small Part Metrology
We detect and measure laser-cut features on both sides of a wafer with less than 1-micron of accuracy. We also perform cosmetic and dimensional inspections, achieving 2-micron fixure repeatability at less than 1-second per measurement and better than 2-micron accuracy.
Fine Wire Processing
We develop systems for processing micro-wire as small as 0.125mm diameter, including precision insertion, coiling, wrapping, alignment and cutting. Our vision-based wire solutions are used in industries and applications such as semiconductor and electronics network infrastructure. As an example, we can successfully insert 0.125mm wire into multiple 0.2mm diametrically opposed holes at the rate of 4 per second.
We integrate Class I through Class IV lasers for many precise welding and soldering applications, particularly where a combination of speed and precision is required. We design systems with safety in mind, creating appropriate light-tight enclosures.
Lamination & Bonding
We build custom lamination and bonding systems to improve quality, throughput, and process control for wafers, MEMS, circuits, RFID tags and other applications. Our systems provide precise control of pressure, temperature, and time.